Method of producing solid state pickup device

Details Method of producing solid state pickup device Method of producing solid state pickup device

2006-10-31

2006-10-31

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S595000, C029S609100, C326S061000, C369S125000, C438S060000, C438S068000, C438S075000

Reexamination Certificate

active

07127793

ABSTRACT:
A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

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“ALPHA, a new contact type linear image sensor” Goto, H.; Maeumura, K.; Morimune, K.; Tada, T.; Sato, T.; Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990; May 13-16, 1990; pp. 7.7/1-7.7/4.

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