Wafer dicing/bonding sheet and process for producing semiconduct

Details Wafer dicing/bonding sheet and process for producing semiconduct Wafer dicing/bonding sheet and process for producing semiconduct

1998-06-17

1999-12-28

Nakarani, D. S.

Stock material or miscellaneous articles

Composite

Of polyimide

428480, B32B 2706

Patent

active

060079207

ABSTRACT:
The wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.

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patent: 5527998 (1996-06-01), Anderson et al.
patent: 5692297 (1997-12-01), Noda
patent: 5705016 (1998-01-01), Senoo et al.

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