Wafer cutting using laser marking

Details Wafer cutting using laser marking Wafer cutting using laser marking

2005-06-28

2005-06-28

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S121000

Reexamination Certificate

active

06911377

ABSTRACT:
An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.

REFERENCES:
patent: 4534804 (1985-08-01), Cade

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