Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent
1994-05-19
1995-02-07
Valentine, Donald R.
Chemistry: electrical and wave energy
Apparatus
Electrolytic
204225, B23H 706, B23H 710, B23H 730
Patent
active
053873319
ABSTRACT:
A wafer cutting device has a plurality of individually highly tensioned diamond impregnated wires that are mounted in a translatable head. Each wire has a tension monitor connected thereto for the purpose of insuring uniform tension and also alerting to breakage. Further, a differential DC voltage is applied to the wires and the crystal with the assistance of electrolytes to improve the removal of material for minimizing damage to the surfaces. The crystal is mounted on a two dimensional stage. During normal cutting the crystal is moved vertically into the cutting wire. The vertical cutting rate is adjusted due to the configuration of the crystal. At the end of cutting, the crystal is moved laterally so as to place a notch in the wafers for the purpose of removing the wafer in a clean break.
REFERENCES:
patent: 3128213 (1964-04-01), Gault et al.
patent: 4096619 (1978-06-01), Cook, Jr.
patent: 4193852 (1980-03-01), Inoue
patent: 4409075 (1983-10-01), Kolbesen
patent: 4574769 (1986-03-01), Ishikawa
patent: 4646710 (1987-03-01), Schmid et al.
patent: 4655191 (1987-04-01), Wells et al.
patent: 4903682 (1990-02-01), Kurokawa
patent: 4920946 (1990-05-01), Kuromatsu
Ahern Brian S.
Clark, Jr. Harry R.
Iseler Gerald W.
Weyburne David W.
Collier Stanton E.
Erlich Jacob N.
The United States of America as represented by the Secretary of
Valentine Donald R.
LandOfFree
Wafer cutting device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer cutting device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer cutting device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1108515