Wafer cooling in a transfer chamber of a vacuum processing syste

Details Wafer cooling in a transfer chamber of a vacuum processing syste Wafer cooling in a transfer chamber of a vacuum processing syste

1997-09-24

1999-12-14

Doerrler, William

Refrigeration

Processes

Treating an article

F25D 2500

Patent

active

060002271

ABSTRACT:
A vacuum processing system has a wafer cooling system disposed on a lid of a transfer chamber so that heated wafers are cooled inside the transfer chamber. The wafer cooling system has a wafer lift assembly and a wafer cooler. The wafer cooler has a cooling plate and a coolant tank disposed through the transfer chamber lid. The wafer lift assembly has a lift actuator disposed on the top of the transfer chamber lid, guide rods to translate the lifting motion through the lid, and wafer supports inside the lid to raise the wafer to a position proximate to the cooling plate. The wafer cools by radiating heat up to the cooling plate, and the coolant tank transfers the heat from the cooling plate.

REFERENCES:
patent: 5220171 (1993-06-01), Hara et al.
patent: 5516732 (1996-05-01), Flegal
patent: 5522215 (1996-06-01), Matsunaga et al.
patent: 5638687 (1997-06-01), Mizohata et al.

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