Wafer color variation correcting method, selective wafer...

Details Wafer color variation correcting method, selective wafer... Wafer color variation correcting method, selective wafer...

2006-04-11

2006-04-11

Mehta, Bhavesh M. (Department: 2625)

Image analysis

Applications

Manufacturing or product inspection

C382S167000, C358S518000, C348S087000, C700S110000, C438S016000, C250S306000

Reexamination Certificate

active

07027638

ABSTRACT:
A method for correcting color variations on the surface of a wafer, a method for selectively detecting a defect from different patterns, and computer readable recording media for the same are provided. Color variations in images of different parts of a wafer can be corrected using the mean and standard deviation of grey level values for the pixels forming each of the different parts of the wafer. In addition, different threshold values are applied to metal interconnect patterns and spaces of the wafer so that a defect can be selectively detected from the different patterns. Thus, a bridge known as a fatal, or killing defect to a semiconductor device can be detected without also falsely detecting grains as fatal defects. Due to increased defect screening capacity of the methods, the defect detecting method can be further efficiently managed.

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