Wafer collective reliability evaluation device and wafer...

Details Wafer collective reliability evaluation device and wafer... Wafer collective reliability evaluation device and wafer...

2007-03-06

2007-03-06

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S536000, C257SE23179

Reexamination Certificate

active

11033390

ABSTRACT:
A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.

REFERENCES:
patent: 2003/0112025 (2003-06-01), Hamilton et al.
patent: 57-102009 (1982-06-01), None
patent: 06-151537 (1994-05-01), None
patent: 11-126807 (1999-05-01), None
patent: 11-150166 (1999-06-01), None
patent: 11-251378 (1999-09-01), None

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