Cleaning and liquid contact with solids – Apparatus – With movable means to cause fluid motion
Reexamination Certificate
2008-06-03
2008-06-03
Perrin, Joseph L. (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With movable means to cause fluid motion
C134S196000, C134S201000, C134S902000
Reexamination Certificate
active
07380560
ABSTRACT:
Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.
REFERENCES:
patent: 6039059 (2000-03-01), Bran
patent: 6140744 (2000-10-01), Bran
patent: 6843257 (2005-01-01), Yeo et al.
patent: 2002/0185152 (2002-12-01), Lauerhaas et al.
patent: 2003-48763 (2000-07-01), None
patent: 2002-0071249 (2002-09-01), None
patent: 2003-0014590 (2003-02-01), None
Lee Il-Sang
Lee Kang-youn
Yeo In-joon
Myers Bigel & Sibley & Sajovec
Perrin Joseph L.
Samsung Electronics Co,. Ltd.
Watson Joy
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