Wafer chuck having thermal plate with interleaved heating...

Details Wafer chuck having thermal plate with interleaved heating... Wafer chuck having thermal plate with interleaved heating...

2005-11-29

2005-11-29

Paik, Sang Y. (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

06969830

ABSTRACT:
A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

REFERENCES:
patent: 5033538 (1991-07-01), Wagner et al.
patent: 5034688 (1991-07-01), Moulene et al.
patent: 5099571 (1992-03-01), Logan et al.
patent: 5213349 (1993-05-01), Elliott
patent: 5651823 (1997-07-01), Parodi et al.
patent: 5846375 (1998-12-01), Gilchrist et al.
patent: 6053982 (2000-04-01), Halpin et al.
patent: 6147334 (2000-11-01), Hannigan
patent: 33 06 999 (1983-02-01), None
patent: 10050811 (1998-02-01), None
patent: WO 01/01460 (2001-01-01), None

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