Wafer burn-in and test system

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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257 48, 3241581, 324765, 437 8, G01R 3128, H01L 2166

Patent

active

055326145

ABSTRACT:
An interconnection system and method of testing and performing burn-in of semiconductor devices prior to separation from the semiconductor wafer on which the devices are formed includes forming interconnection layers of contacts and conductors over the devices and then testing and performing burn-in on the devices. Faulty devices are disconnected from the conductors prior to performing additional test and burn-in. The interconnections are removed prior to separating the device on the wafer, and prior to further possible tests and packaging.

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"Wafer Burn-In Isolation Circuit", IBM Technical Disclosure Bulletin, vol. 32, No. 6B, Nov. 1989, New York, pp. 442-443.

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