Wafer-bonding using solder and method of making the same

Details Wafer-bonding using solder and method of making the same Wafer-bonding using solder and method of making the same

2005-03-22

2005-03-22

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S785000, C257S786000, C257S772000

Reexamination Certificate

active

06870262

ABSTRACT:
A method is provided for forming a wafer stack. This may include providing a first wafer having a first plurality of metalized trenches on a surface of the first wafer. A second wafer may be provided having a second plurality of metalized trenches on a surface of the second wafer facing the first wafer. The first plurality of metalized trenches may be solder bonded to the second plurality of metalized trenches.

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