Wafer bonded access device for multi-layer phase change...

Details Wafer bonded access device for multi-layer phase change... Wafer bonded access device for multi-layer phase change...

2011-04-19

2011-04-19

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S102000, C257S002000, C257S042000, C257SE21068, C257SE29087, C257SE29100, C257SE47001

Reexamination Certificate

active

07927911

ABSTRACT:
A method for fabricating a multi-layer phase change memory device includes forming a phase change memory layer including a plurality of phase change memory elements on a word line formed on a plurality of semiconductor devices on a first semiconductor substrate, each phase change element having a notch formed at an upper surface thereof, forming an access device layer including plurality of access devices on a second semiconductor substrate, each access device having a conductive bump formed thereon, and combining the first and second semiconductor substrates and slidably inserting and locking each conductive bump of the plurality of access devices into each notch of the plurality of phase change memory elements to electrically connect the access devices to the phase change memory elements.

REFERENCES:
patent: 5118299 (1992-06-01), Burns et al.
patent: 5903059 (1999-05-01), Bertin et al.
patent: 5956575 (1999-09-01), Bertin et al.
patent: 6393685 (2002-05-01), Collins
patent: 7057923 (2006-06-01), Furkay et al.
patent: 2001/0032702 (2001-10-01), Feldman et al.
patent: 2004/0077123 (2004-04-01), Lee et al.
patent: 2004/0195604 (2004-10-01), Hwang et al.
patent: 2005/0180191 (2005-08-01), Xu
patent: 2007/0158395 (2007-07-01), Fasano et al.
patent: 2008/0178436 (2008-07-01), Zhang et al.

Affiliated with

Also associated with

Rating

Wafer bonded access device for multi-layer phase change... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer bonded access device for multi-layer phase change..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer bonded access device for multi-layer phase change... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2732221