Wafer bake system and method for operating the same

Details Wafer bake system and method for operating the same Wafer bake system and method for operating the same

2006-01-31

2006-01-31

Paik, Sang Y. (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C118S724000

Reexamination Certificate

active

06992270

ABSTRACT:
A wafer bake system includes a heating plate for heating a wafer, and means for supporting the wafer to be spaced from the heating plate, wherein a gap distribution between the wafer and the heating plate is measured, and a temperature gradient of the wafer is controlled based on the measured gap distribution.

REFERENCES:
patent: 5563684 (1996-10-01), Stagaman
patent: 6313567 (2001-11-01), Maltabes et al.
patent: 6402509 (2002-06-01), Ookura et al.
patent: 6465763 (2002-10-01), Ito et al.
patent: 6478578 (2002-11-01), Choi et al.

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