Wafer backing member for mechanical and chemical-mechanical plan

Details Wafer backing member for mechanical and chemical-mechanical plan Wafer backing member for mechanical and chemical-mechanical plan

1996-10-18

1998-11-03

Breneman, R. Bruce

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, 216 88, 156345LP, 451 41, 451287, 451398, H01L 21302

Patent

active

058308067

ABSTRACT:
A wafer backing member for use in a wafer carrier of a chemical-mechanical planarization machine between the wafer carrier and the backside of a semiconductor wafer or other substrate. In one embodiment, the backing member has a body including a first layer to abut against the backside of the wafer and a second layer to abut against the wafer carrier. The first layer is substantially rigid or substantially non-compressible to preferably inhibit flexing of the wafer, and the second layer is resiliently compressible to cushion the backside of the wafer. In operation, the compressible second layer reduces the differences in pressure from one area of the wafer to another and the rigid first layer distributes the forces more uniformly across the backside of the wafer. As a result, the wafer backing member substantially reduces the center-to-edge difference in polishing rates to more uniformly planarize the front face of the wafer.

REFERENCES:
patent: 4132037 (1979-01-01), Bonora
patent: 5101602 (1992-04-01), Hashimoto
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5398459 (1995-03-01), Okumura et al.
patent: 5527209 (1996-06-01), Volodarsky et al.
patent: 5573448 (1996-11-01), Nakazima et al.
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5593537 (1997-01-01), Cote et al.
patent: 5624299 (1997-04-01), Shendon

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