Radiation imagery chemistry: process – composition – or product th – Effecting frontal radiation modification during exposure,...
Reexamination Certificate
2004-05-04
2010-12-21
Davis, Daborah Chacko (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Effecting frontal radiation modification during exposure,...
C430S004000, C430S311000
Reexamination Certificate
active
07855048
ABSTRACT:
A method of fabricating a semiconductor device using lithography. The method can include providing a wafer assembly having a layer to be processed disposed under a photo resist layer and illuminating the wafer assembly with an exposure dose transmitted through a birefringent material disposed between a final optical element of an imaging subsystem used to transmit the exposure dose and the photo resist layer. Also disclosed is a wafer assembly from which at least one semiconductor device can be fabricated. The wafer assembly can include a layer to be processed, a photo resist layer disposed over the layer to be processed and a contrast enhancing, birefringent top anti-reflecting coating (TARC).
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Kye Jong-wook
LaFontaine Bruno M.
Pawloski Adam R.
Tabery Cyrus E.
Advanced Micro Devices , Inc.
Chacko Davis Daborah
Farjami & Farjami LLP
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