Wafer and method

Measuring and testing – Vibration – Sensing apparatus

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C073S861610, C073S861230

Reexamination Certificate

active

06973833

ABSTRACT:
A wafer for placement in a pipe. The wafer includes a housing having an outer surface and an orifice adapted to allow fluid flowing in the pipe to pass through the housing. The housing has at least a first port extending into the housing from the outer surface for holding a first acoustic transducer. The wafer includes means for attaching the housing to the pipe. A method for obtaining information about fluid in a pipe.

REFERENCES:
patent: 4141246 (1979-02-01), Randolph
patent: 6016023 (2000-01-01), Nilsson et al.
patent: 6101885 (2000-08-01), Touzin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wafer and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3495703

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.