Material or article handling – Associated with semiconductor wafer handling – Wafer cassette transporting
Patent
1998-08-07
2000-08-08
Bueker, Richard
Material or article handling
Associated with semiconductor wafer handling
Wafer cassette transporting
B65G 6500
Patent
active
060992425
ABSTRACT:
A wafer aligning apparatus for semiconductor device fabrication includes a cassette support on which is mounted a cassette holding wafers immersed in a non-conducting fluid. A guide roller is composed of carbon fiber reinforced polyether and rotates in contact with circumferential edges of the wafers. A wafer support holds the wafers apart from the roller when flat zones of the wafers are aligned with the wafer support
REFERENCES:
patent: 5620295 (1997-04-01), Nishi
patent: 5845660 (1998-12-01), Shindo et al.
patent: 5895191 (1999-04-01), Bonora et al.
patent: 5940985 (1999-08-01), Kamikawa et al.
An Sung-soo
Hong Hyung-sik
Bueker Richard
Fieler Erin
Samsung Electronics Co,. Ltd.
LandOfFree
Wafer aligning apparatus for semiconductor device fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wafer aligning apparatus for semiconductor device fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer aligning apparatus for semiconductor device fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1144217