Void-free circuit board and semiconductor package having the...

Details Void-free circuit board and semiconductor package having the... Void-free circuit board and semiconductor package having the...

2008-07-15

2008-07-15

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S787000

Reexamination Certificate

active

11457767

ABSTRACT:
A void-free circuit board and a semiconductor package having the same includes a protective layer covering and protecting an electrode pattern formed on an upper surface of a substrate. The protective layer is applied around a solder ball provided on the electrode pattern except on an immediate vicinity of the solder ball to form an opening. The semiconductor package also includes at least one gap compensation part comprising a protrusion that comes in contact with an underfill material injected to the opening before the electrode pattern. The protrusion has a thickness substantially the same as that of a portion of the electrode pattern exposed in the opening. This prevents voids with air captured therein due to non-uniform capillary action during injection of the underfill material.

REFERENCES:
patent: 5647123 (1997-07-01), Greenwood et al.
patent: 6048656 (2000-04-01), Akram et al.
patent: 6458681 (2002-10-01), DiStefano et al.
patent: 2002/0060368 (2002-05-01), Jiang
patent: 2000-216195 (2000-08-01), None
Chinese Intellectual Property Office, Office Action mailed Jan. 18, 2008 and English Translation.

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