VLSI-based system for durable high-density information storage

Details VLSI-based system for durable high-density information storage VLSI-based system for durable high-density information storage

2000-09-15

2004-01-20

Baxter, Janet (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S022000, C430S322000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06680162

ABSTRACT:

BACKGROUND OF THE INVENTION
This invention relates in general to VLSI fabrication techniques and, more specifically, to using these techniques to store information.
Any unnecessary traces of a metal, an oxide or a polysemiconductor are avoided in semiconductor processing. Adding unnecessary traces makes the mask and fabrication more complex. This added complexity can increase the likelihood of defects in the finished semiconductor circuit. Consequently, semiconductor circuits avoid use of unnecessary traces.
Progress in VLSI technology over the past few decades has been phenomenal. Packing densities have increased by several orders of magnitude. However, to date, VLSI technology has been used largely for creating electronic circuits, micro-machines or sensors. Other uses for the VLSI technology are needed.
SUMMARY OF THE INVENTION
The invention relates to using VLSI techniques to store information on a substrate. One embodiment of a die with text deposited upon the die uses semiconductor processing techniques during fabrication. Included in the die are a substrate, a first paragraph and a second paragraph. The first and second paragraphs are in contact with the substrate. The second paragraph is aligned with the first paragraph in a column.


REFERENCES:
patent: 3626824 (1971-12-01), Kolb
Nadim Maluf,An Introduction to Microelectromechanical Systems Enginneering,Microelectromechanical Systems Series, 2000 Artech House, Inc., Norwood, MA, 4 pages, Preface p.xx.

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