Virtual path for interconnect fabric using bandwidth process

Details Virtual path for interconnect fabric using bandwidth process Virtual path for interconnect fabric using bandwidth process

2002-10-31

2008-01-22

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

07322021

ABSTRACT:
The present invention pertains to a system and method for specifying links, connectivity and bandwidth in an interconnect fabric. For example, a method for allocating connectivity and bandwidth of an integrated circuit may include receiving an interconnect fabric description, the described interconnect fabric having a plurality of platforms linked over an isochronous interconnect fabric. An arrangement of links of the received interconnect fabric is virtualized based on bandwidth. An arrangement of links of the received interconnect fabric is virtualized based on connectivity. The links are allocated on the basis of the virtualized link arrangements based on bandwidth and connectivity.

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