Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-05-29
2007-05-29
Norris, Jeremy C. (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S262000, C439S066000, C439S591000
Reexamination Certificate
active
10669982
ABSTRACT:
A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads. The flexible circuit also includes vias disposed proximate the first type of electrical connection pads and extended through the ground plane to provide for electrically coupling the first transmission line and the second transmission line, such that the vias reduce discontinuity in the ground plane and aggregate discontinuity in the flex circuit.
REFERENCES:
patent: 5362656 (1994-11-01), McMahon
patent: 5448020 (1995-09-01), Pendse
patent: 5635424 (1997-06-01), Heim et al.
patent: 6137168 (2000-10-01), Kirkman
patent: 6396712 (2002-05-01), Kuijk
patent: 6762367 (2004-07-01), Audet et al.
patent: 6962829 (2005-11-01), Glenn et al.
patent: 2002/0044423 (2002-04-01), Primavera et al.
patent: 2002/0046880 (2002-04-01), Takubo et al.
patent: 2002/0139566 (2002-10-01), Strandberg
patent: 2003/0164541 (2003-09-01), Kheng
patent: 2001/352000 (2002-08-01), None
Ali Mohammed Ershad
Lemoff Brian
Rosenau Steven
Simon Jonathan
Windover Lisa Anne
Avago Technologies General IP ( Singapore) Pte. Ltd.
Norris Jeremy C.
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