4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With semiconductor element forming part

Jonathan Simon

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Apparatus and method for controlling movement of a device...

Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate

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Apparatus and method for sequestering a contaminant by use...

Chemical apparatus and process disinfecting – deodorizing – preser – Chemical reactor – Waste gas purifier
Reexamination Certificate

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Chip-mounted enclosure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Cooling of optoelectronic elements

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Cooling of optoelectronic elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2542804

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