Via fill compositions for direct attach of devices and methods f

Details Via fill compositions for direct attach of devices and methods f Via fill compositions for direct attach of devices and methods f

1993-11-17

1998-06-16

Bareford, Katherine

Coating processes

Measuring, testing, or indicating

427 97, 427101, 29846, B05D 512

Patent

active

057666709

ABSTRACT:
The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

REFERENCES:
patent: 3546015 (1970-12-01), Vulliez
patent: 3601523 (1971-08-01), Arndt et al.
patent: 4008300 (1977-02-01), Ponn
patent: 4179797 (1979-12-01), Johnson
patent: 4278706 (1981-07-01), Barry
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4415607 (1983-11-01), Denes et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5047368 (1991-09-01), Schnitker
patent: 5098771 (1992-03-01), Friend
patent: 5133120 (1992-07-01), Kawakami et al.
IBM Technical Disclosure Buleetin, vol. 30, No. 7, p. 135, Dec. 1987.

Affiliated with

Also associated with

Rating

Via fill compositions for direct attach of devices and methods f does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via fill compositions for direct attach of devices and methods f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via fill compositions for direct attach of devices and methods f will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1722461