Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping
Reexamination Certificate
2007-06-05
2007-06-05
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Device held in place by clamping
C257S726000, C257S731000
Reexamination Certificate
active
10648164
ABSTRACT:
A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. At least a portion of the semiconductor device may be exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. The alignment device may secure the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.
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Brooks Jerry M.
Farnworth Warren M.
Kinsman Larry D.
Lee Terry R.
Moden Walter L.
Pert Evan
Tran Tan
TraskBritt PC
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