Vertical stack type multi-chip package having improved...

Details Vertical stack type multi-chip package having improved... Vertical stack type multi-chip package having improved...

2007-07-23

2009-11-10

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S126000, C438S127000

Reexamination Certificate

active

07615415

ABSTRACT:
A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit. The second semiconductor chip is connected to the organic substrate by a second wire. A mold resin seals the second semiconductor chip and a solder ball is bonded to a solder ball pad below the organic substrate.

REFERENCES:
patent: 6316840 (2001-11-01), Otani
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6861288 (2005-03-01), Shim et al.
patent: 7049691 (2006-05-01), Karnezos
patent: 2004/0183180 (2004-09-01), Chung et al.

Affiliated with

Also associated with

Rating

Vertical stack type multi-chip package having improved... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vertical stack type multi-chip package having improved..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vertical stack type multi-chip package having improved... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4138008