Vertical split gate memory cell and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C438S259000

Reexamination Certificate

active

07126188

ABSTRACT:
A vertical split gate memory formed in a trench of a semiconductor substrate comprises a first doping region, a second doping region, a conductive line, a conductive spacer and a conductive plug, wherein the conductive line, conductive spacer and conductive plug serve as a select gate, a floating gate and a control gate of the vertical split gate memory cell, respectively. The first doping region of a first conductive type is underneath the bottom of the trench, whereas the second doping region of the first conductive type is beside the top of the trench. The conductive line serving as the select gate is formed at the bottom of the trench and in operation relation to the first doping region. The conductive spacer is formed beside the sidewall of the trench and above the conductive line. The conductive plug is insulated from the conductive spacer and the conductive line and in operation relation to the conductive spacer.

REFERENCES:
patent: 5386132 (1995-01-01), Wong
patent: 5739567 (1998-04-01), Wong
patent: 6087222 (2000-07-01), Jung Lin et al.
patent: 6781191 (2004-08-01), Lin

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