Vertical passive components for surface mount assembly

Details Vertical passive components for surface mount assembly Vertical passive components for surface mount assembly

1998-03-13

2000-03-21

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361763, 361764, 361765, 361766, 361767, 361782, 361783, 257766, 257686, 257724, 2281231, H05K 702

Patent

active

060409835

ABSTRACT:
In a surface mount assembly, an active integrated circuit device, such as, for example, a dynamic random access memory, typically has a lead finger attached to a solder pad of a printed wiring board. The surface mount assembly is significantly improved by configuring a passive component, such as a resistor or capacitor, such that it has metallic terminations on an upper and lower surface so that it may be positioned between the solder pad of the printed wiring board and the lead finger.

REFERENCES:
IBM Technical Disclosure Bulletin vol.33 No. 1A, Jun. 1990.

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