Vertical paddle plating cell

Details Vertical paddle plating cell Vertical paddle plating cell

1995-05-16

1996-05-14

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204224M, 204228, 204273, 204275, 204237, 204238, 204225, 204DIG7, C25D 1706, C25F 700

Patent

active

055164129

ABSTRACT:
An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the article to define a cathode. An anode is positioned vertically to close the second open end, with the assembly defining a substantially closed, six-sided inner chamber for receiving an electrolyte therein for electroplating the article. The article and surrounding thief are coextensively aligned with the anode, with the floor, ceiling, front and back walls being effective for guiding electrical current flux between the cathode and the anode. In a preferred embodiment, the cell is disposed as an inner cell inside an outer cell substantially filled with the electrolyte, and a paddle is disposed inside the inner cell for agitating the electrolyte therein. The rack is removable and installable vertically upwardly which allows for automated handling thereof.

REFERENCES:
patent: 2697690 (1954-12-01), Beebe, Jr.
patent: 3649509 (1972-03-01), Morawetz et al.
patent: 3652442 (1972-03-01), Powers et al.
patent: 4022678 (1977-05-01), Wojcik et al.
patent: 4102756 (1978-07-01), Castellani et al.
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4359375 (1982-11-01), Smith
patent: 4595478 (1986-06-01), Pellegrino et al.
patent: 4696729 (1987-09-01), Santini
patent: 5135636 (1992-08-01), Yee et al.
patent: 5228967 (1993-07-01), Crites et al.
patent: 5312532 (1994-05-01), Andricacos et al.
Mehdizadeh et al, "Optimization of Electrodeposit Uniformity by the use of auxiliary Electrodes," J. Electrochem. Soc., vol. 137, No. 1, Jan. 1991, pp. 110-117.
Schwartz et al, "Mass-Transfer Studies in a Plating Cell with a Reciprocating Paddle," J. Electrochem. Soc., vol. 134, No. 7, Jul. 1987, pp: 1639-1645.
Rice et al, "Copper Electrodeposition Studies With a Reciprocating Paddle," J. Electrochem. Soc., vol. 135, No. 11, Nov. 1988, pp: 2777-2780.
Mehdizadeh et al, "The Influence of Lithographic Patterning on Current Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects," J. Electrochem. Soc., vol. 140, No. 12, Dec. 1993, pp: 3497-3505.

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