Vertical MOSFET device having frontside and backside contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

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Details

257236, 257242, 257263, 257778, H01L 27148, H01L 29768, H01L 2980, H01L 2348

Patent

active

055788416

ABSTRACT:
A multiple output, vertical MOSFET device (11) with improved electrical performance and thermal dissipation is integrated with an additional semiconductor device or semiconductor circuit (18) on a single semiconductor substrate (34). The method of making the vertical MOSFET device (11) involves thinning the semiconductor substrate (34) after fabricating the vertical MOSFET device (11) and the semiconductor circuit (18) to reduce the vertical component of electrical and thermal resistance and to increase the thermal dissipation efficiency. Electrical performance is improved by thinning the semiconductor substrate (34) and by providing a low resistivity, patterned metal buried layer. Thermal management is enhanced by using flip chip bumps (24) to dissipate heat from a top surface (31) of the semiconductor substrate (34) and by using the patterned buried metal layer (26) to dissipate heat from a bottom surface (32) of the semiconductor substrate (34).

REFERENCES:
patent: 5045902 (1991-09-01), Bancal
patent: 5119162 (1992-06-01), Todd et al.
patent: 5273615 (1993-12-01), Asetta et al.
patent: 5283454 (1994-02-01), Cambou
patent: 5407866 (1995-04-01), Sellers
patent: 5413952 (1995-05-01), Pages et al.

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