Vertical mold die press machine

Details Vertical mold die press machine Vertical mold die press machine

2005-03-29

2005-03-29

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S124000, C438S127000

Reexamination Certificate

active

06872593

ABSTRACT:
A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top layer down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.

REFERENCES:
patent: 4480975 (1984-11-01), Plummer et al.
patent: 4872825 (1989-10-01), Ross
patent: 5910010 (1999-06-01), Nishizawa et al.

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