Vertical integration of a MEMS structure with electronics in...

Details Vertical integration of a MEMS structure with electronics in... Vertical integration of a MEMS structure with electronics in...

2007-07-24

2007-07-24

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

Reexamination Certificate

active

10771135

ABSTRACT:
A wafer-scale fabrication method for providing MEMS assemblies having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided. Fabrication cost is greatly reduced by wafer scale integration.

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