Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2002-09-09
2004-05-11
Hoang, Huan (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S301000, C257S302000
Reexamination Certificate
active
06734485
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to a trench-type DRAM memory cell and its DRAM arrays and, more particularly, to a vertical DRAM cell structure and its contactless DRAM arrays.
2. Description of Related Art
A dynamic random-access-memory (DRAM) cell including an access transistor and a storage capacitor has become the most important storage element in electronic system, especially in computer and communication system. The DRAM density is increased very rapidly in order to decrease the cost per bit and, therefore, an advanced photolithography is needed to decrease the minimum-feature-size (F) of a cell.
The output voltage of a DRAM cell is proportional to the capacitance value of the storage capacitor of the DRAM cell and, therefore, the storage capacitor must have a satisfactory capacitance value to have stable operation of the cell as the applied voltage is scaled. Basically, the storage capacitor can be implemented in a trench-type or a stack-type. The trench-type is formed by forming a deep trench in a semiconductor substrate without increasing the surface area of the semiconductor-substrate surface. The stack-type is formed by implementing a capacitor structure over the access transistor and its nearby dummy-transistor structure through the conductive contact-plug over the node diffusion region of the access transistor. Basically, the cell size of the stack-type DRAM is limited by a dummy transistor being formed over the isolation region. Accordingly, the limit cell size of the stack-type DRAM is 8F
2
for shallow-trench-isolation. However, the cell size of a trench-type lateral transistor DRAM is limited by the space between nearby deep-trench capacitors and the separation between the lateral access transistor and the deep-trench capacitor. Therefore, the limit cell size of a trench-type lateral transistor DRAM is also 8F
2
if the separation between the lateral access transistor and the trench capacitor can't be minimized.
A typical example of a trench-type lateral transistor DRAM cell is shown in
FIG. 1
, in which a deep trench is formed in a semiconductor substrate
100
. A trench capacitor is formed in a lower portion of the deep trench, in which a lower capacitor node
101
is formed by a heavily-doped n+ diffusion region using an arsenic-silicate-glass (ASG) film as a dopant diffusion source; an upper capacitor node
103
a
is made of doped polycrystalline-silicon; and a capacitor-dielectric layer
102
is formed by a composite dielectric layer such as an oxide-nitride-oxide structure or a nitride-oxide structure. An oxide collar
104
is used to separate the lower capacitor node
101
from a source diffusion region
105
a
,
105
b
, and a capacitor-node connector
103
b
being made of doped polycrystalline-silicon is used to electrically connect the upper capacitor node
103
a
to a source conductive node
103
c
. The source conductive node
103
c
is made of heavily-doped polycrystalline-silicon to act as a dopant diffusion source for forming an n+ source diffusion region
105
a
; A shallow-trench-isolation (STI) region
106
is filled with a CVD-oxide layer in order to separate nearby trench capacitors. Two gate-stacks
108
,
109
are formed over an upper surface, in which one gate-stack
108
is acted as a passing word line and another gate-stack
109
is acted as an excess transistor. A common-source diffusion region
105
b
,
105
a
and a common-drain diffusion region
107
for a bit-line node are formed in an upper surface portion of the semiconductor substrate
100
. From
FIG. 1
, it is clearly seen that the limit cell size is 8F
2
if the space between two nearby trench capacitors is defined to be a minimum-feature-size (F) of technology used.
Apparently, the common-source diffusion region
105
b
,
105
a
and the gate-stack
109
shown in
FIG. 1
can be removed and are formed in the deep-trench region to become a vertical DRAM cell structure, then the semiconductor surface area occupied by a cell can be reduced to be 4F
2
. However, a depth of the deep trenches becomes deeper, resulting in a further problem for forming a deeper trench. Moreover, the threshold-voltage and the punch-through voltage of the vertical transistor are difficult to be controlled, and a longer channel length is therefore used by the prior art. As a consequence, a deeper trench depth is required, and a slower read/write speed of a memory cell due to a longer channel length becomes another serious problem for the prior art.
It is, therefore, a major objective of the present invention to offer a vertical DRAM cell structure for obtaining a cell size of 4F
2
.
It is another objective of the present invention to easily offer different implant regions for forming punch-through stops and adjusting threshold-voltages of the vertical transistor and the parasitic collar-oxide transistor in a self-aligned manner so a deeper trench is not required.
It is a further objective of the present invention to offer a manufacturing method for forming a vertical DRAM cell structure and its contactless DRAM arrays with less masking photoresist steps.
It is yet another objective of the present invention to offer two different contactless DRAM array structures for high-speed read and write operations.
SUMMARY OF THE INVENTION
A vertical DRAM cell structure and its contactless DRAM arrays are disclosed by the present invention. The vertical DRAM cell structure comprises a trench structure and a common-drain structure, in which the trench structure comprises a deep-trench region having a vertical transistor and a trench-isolation region having a second-type shallow-trench-isolation region formed in a side portion of the deep-trench region and the common-drain structure includes a common-rain diffusion region and different implant regions under the common-drain diffusion region for forming punch-through stops of the vertical transistor and the parasitic collar-oxide. transistor. The deep-trench region comprises a lower capacitor node made of an n+ diffusion region being formed in a lower portion of a deep trench, a capacitor-dielectric layer being formed over the lower capacitor node, an upper capacitor node being formed over the capacitor-dielectric layer, a collar-oxide layer together with a capacitor-node connector being formed over a portion of the capacitor-dielectric layer and the upper capacitor node, a source conductive node being formed over the collar-oxide layer and the capacitor-node connector to act as a dopant diffusion source for forming a common-source diffusion region, an isolation silicon-dioxide node being formed over the source conductive node, and a conductive-gate node of a vertical transistor being formed on the isolation silicon-dioxide node. The second-type shallow-trench-isolation region being formed in a side portion of the deep-trench region comprises a second-type raised field-oxide layer with a bottom surface level approximately equal to that of the collar-oxide. layer and an n+ diffusion region being formed under the second-type raised field-oxide layer. The vertical transistor comprises a planarized capping conductive-gate layer defined by a third sidewall dielectric spacer being connected with the conductive-gate node, a gate-dielectric layer being formed over a portion of a sidewall of the deep trench, a common-drain diffusion region of a second conductivity type being formed over an upper portion of the semiconductor substrate, and the common-source diffusion region of the second conductivity type being formed near the source conductive node for forming a first-type vertical DRAM cell; and comprises the conductive-gate node being formed in an upper portion of the deep trench, a planarized common-gate conductive island integrated with a metal word-line being connected with a portion of the conductive-gate node through a planarized conductive-gate connector, a gate-dielectric layer being formed over a portion of a sidewall of the deep trench, a common-drain diffusion region of a second c
Hoang Huan
Nguyen Thinh T
Pro-Techtor Inter-national Services
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