Vertical conducting power semiconductor devices implemented...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE29260, C257SE21629

Reexamination Certificate

active

07132321

ABSTRACT:
Semiconductor substrates suitable for making thin vertical current conducting devices are made by providing a relatively thick semiconducting substrate with at least one conductivity type having a thickness of from about 100 μm to 700 μm. At least one active device region is optionally first formed on a first side. Then the semiconducting substrate is thinned in at least one selected region on the other side below at least partially where the active device will be on the first side so as to have the selected region thinned to a thickness ranging from about 10 μm to 400 μm to form at least one deep trench. The depth of the thinning of the semiconducting substrate is controlled when the substrate has more than one conductivity type layers or more than one conductivity type layer concentrations so that either (a) some of the first thinned conductivity type layer or some of the first thinned conductivity type layer concentration remains or (b) the thinning proceeds all the way through the first conductivity type layer or all the way through the first conductivity type layer concentration. A conductivity type dopant can be optionally formed in the semiconductor substrate in the thinned selected region on the second side. Finally, a current electrode is formed on the second side in contact with said thinned selected region or said conductivity type dopant in said thinned selected region. In the event the at least one active device region was not initially formed in the first step, then it can be formed at the end.

REFERENCES:
patent: 3928091 (1975-12-01), Tachi et al.
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5496755 (1996-03-01), Bayraktaroglu
patent: 5643803 (1997-07-01), Fukada et al.
patent: 5698453 (1997-12-01), Green et al.
patent: 5827755 (1998-10-01), Yonehara et al.
patent: 6081006 (2000-06-01), Nelson
patent: 6096656 (2000-08-01), Matzke et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vertical conducting power semiconductor devices implemented... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vertical conducting power semiconductor devices implemented..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vertical conducting power semiconductor devices implemented... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3689477

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.