Vertical channel device having buried source

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257332, 257333, 257343, H01L 2976, H01L 2974, H01L 31062, H01L 31113

Patent

active

056273932

ABSTRACT:
A structure is provided comprising a semiconductor substrate having a first conductivity type, a buried source region having a second opposite conductivity type, and an epitaxial layer of the second conductivity type having a lower dopant concentration than the buried source region. Field oxide regions are formed at outer edges of the epitaxial layer. A well region of first conductivity type is implanted into the central portion of the epitaxial layer to define the active area. Trenches are etched through the well region into the buried source region. A first layer of silicon oxide is grown on the surface and within the trenches. Gate electrodes are formed by depositing a layer of polysilicon and etching back to leave the polysilicon layer only within the trenches. Ions of second conductivity type are implanted into the top portion of the well region to form drain regions. A second layer of silicon oxide is deposited over the top surfaces and planarized. Contact trenches are etched through the second silicon oxide layer and the field oxide regions to connect to the buried source region. A second set of contact trenches are etched through portions of the second silicon oxide layer to the underlying drain regions. A layer of tungsten is deposited and etched back leaving the tungsten within the first and second trenches. Interconnections are made between the source and drain regions to complete the fabrication.

REFERENCES:
patent: 4791462 (1988-12-01), Blanchard et al.
patent: 5164325 (1992-11-01), Cogan et al.
patent: 5378914 (1995-01-01), Ohzu et al.
patent: 5473176 (1995-12-01), Kakumoto

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Vertical channel device having buried source does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vertical channel device having buried source, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vertical channel device having buried source will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2134495

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.