Variable thickness pads on a substrate surface

Details Variable thickness pads on a substrate surface Variable thickness pads on a substrate surface

2006-01-24

2006-01-24

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

C438S129000, C438S599000, C257S775000, C257S778000, C257S784000

Reexamination Certificate

active

06989297

ABSTRACT:
An electronic structure, and associated method of fabrication, that includes a substrate having attached circuit elements and conductive bonding pads of varying thickness. Pad categories relating to pad thickness include thick pads (17 to 50 microns), medium pads (10–17 microns), and thin pads (3 to 10 microns). A thick pad is used for coupling a ball grid array (BGA) to a substrate with attachment of the BGA to a circuit card. A medium pad is useful in flip-chip bonding of a chip to a substrate by use of an interfacing small solder ball. A thin copper pad, coated with a nickel-gold layer, is useful for coupling a chip to a substrate by use of a wirebond interface. The electrical structure includes an electrical coupling of two pads having different thickness, such that the pads are located either on the same surface of a substrate or on-opposite sides of a substrate.

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