Coating apparatus – Gas or vapor deposition
Patent
1992-05-04
1993-12-14
Hearn, Brian E.
Coating apparatus
Gas or vapor deposition
118723R, 118724, 118730, 156345, 156643, H01L 2100
Patent
active
052698475
ABSTRACT:
A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.
REFERENCES:
patent: 4123316 (1978-10-01), Tsuchimoto
patent: 4307283 (1981-12-01), Zajac
patent: 4392915 (1983-07-01), Zajac
patent: 4539068 (1985-09-01), Takagi et al.
patent: 4612077 (1986-09-01), Tracy et al.
patent: 4736705 (1988-04-01), Weyburne
patent: 4795529 (1989-01-01), Kawasaki et al.
patent: 4818326 (1989-04-01), Liu et al.
patent: 4872947 (1989-10-01), Wang et al.
patent: 4913929 (1990-04-01), Moslehi et al.
"The American Heritage Dictionary", ed., Morris; .COPYRGT.1969, p. 794.
Co-Pending Application entitled "Double-Dome Reactor for Semiconductor Processing" of Roger Anderson et al.; U.S. Ser. No. 07/491,416.
Anderson Roger N.
Johnson Wayne
Lindstrom Paul R.
Applied Materials Inc.
Goudreau George
Hearn Brian E.
Morris Birgit E.
LandOfFree
Variable rate distribution gas flow reaction chamber does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Variable rate distribution gas flow reaction chamber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Variable rate distribution gas flow reaction chamber will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1701719