Variable rate distribution gas flow reaction chamber

Coating processes – Coating by vapor – gas – or smoke

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Details

4272551, 4272552, 1566431, 1566461, 216 38, C23C 1600, H01L 21306

Patent

active

054550700

ABSTRACT:
A wafer processing reactor having an input manifold to enable control of a process gas flow profile over a wafer that is being processed. Both process gas relative concentrations and flow rates can be controlled, thereby enabling an increased uniformity of processing across the wafer.

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