Variable pre-spin drying time control of photoresists thickness

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430313, 430314, 430323, 430324, 430325, 430935, G03C 500, G03C 176, G03C 186, G03C 194

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042810574

ABSTRACT:
Resist is applied to a surface with a syringe, or other suitable dropper, equipped with a millipore filter to remove contaminants. The surface is completely flooded with resist. Resist is allowed to remain on the surface of the evaporated metal for a period of time prior to spin coating. Allowing resist to remain on the surface prior to coating produces a uniform film. For a 2 micron thick uniform resist coating, a minimum of 15 seconds is allowed prior to spinning while in the case of a 4 micron thick resist coating a much longer period is allowed.
For the application of a 2 micron film, the resist material after partial drying for approximately 15 seconds is spun at 2000 rpm for 30 seconds. In order to apply a 5 micron thick resist film, resist is spun at 2000 rpm for 30 seconds after partial drying for approximately 10 minutes.

REFERENCES:
patent: 3576722 (1971-04-01), Fennimore
"Plating", May 1969 pp. 505-510, Puffek.
Proceedings of the Second Kodak Seminar on Micro-minaturization, Apr. 4-5, 1966, pp. 36-43.
Data Release, Incidental Intelligence about Kodak Resists, pp. 8-10.
Data Release, Kodak Autopositive Resist Type 3, Kodak Pamphlet No. p-194 (1969).

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