Variable-density preforms

Details Variable-density preforms Variable-density preforms

2007-12-03

2011-12-13

Choi, Ling (Department: 1761)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

C264S328140, C264S273000, C264S269000, C249S105000

Reexamination Certificate

active

08075827

ABSTRACT:
Provided are novel devices and methods for making a variable density preform, the methods comprising obtaining a slurry comprising a reinforcement particle component and a liquid component; obtaining a die cavity having at least one inlet opening and at least one exit opening defining at least one die cavity flow path therebetween directed toward the exit opening, the at least one exit opening suitably sized or configured to provide for exit of the at least one liquid component while impeding or blocking exit of the at least one reinforcement particle component; and introducing the slurry under pressure, and for a sufficient time period, through the inlet orifice into the die cavity flow path to provide for a decreasing pressure gradient along the flow path direction, to provide for a variable density of the at least one particle component, the particle density increasing in the at least one flow path direction.

REFERENCES:
patent: 3233012 (1966-02-01), Bodine, Jr.
patent: 4233045 (1980-11-01), Sarkar
patent: 4995444 (1991-02-01), Jolly
patent: 5256875 (1993-10-01), Hoekman
patent: 5908587 (1999-06-01), Gross et al.
patent: 5980792 (1999-11-01), Chamlee
patent: 6375877 (2002-04-01), Lauf
patent: 2007/033378 (2007-03-01), None
patent: WO2007033378 (2007-03-01), None

Affiliated with

Also associated with

Rating

Variable-density preforms does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Variable-density preforms, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Variable-density preforms will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4299849