Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1979-11-08
1981-11-10
Bernstein, Hiram
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG77, 23305R, C30B 2502
Patent
active
042996490
ABSTRACT:
The specification describes a process for growing selected compound semiconductors of high stoichiometry and purity and includes the steps of providing both a dynamic vacuum and a predetermined temperature profile in a container or tube containing a chosen semiconductor source material. The dynamic vacuum is used to create a predetermined minimum overpressure. P.sub.min, in this container with respect to the vapor pressure of the source material, while simultaneously removing impurities through in opening in the container during the crystal growth process. This process involves the vapor transport of elements of the selected compound semiconductor from the source material to a suitable support member, such as a graphite crucible which is maintained at a predetermined uniform controlled temperature. Alternatively, the crystal growth process can be in the form of a vapor phase epitaxial process wherein the selected compound semiconductor is epitaxially deposited on a chosen semiconductor substrate whose temperature is also closely controlled.
REFERENCES:
patent: 3121062 (1964-02-01), Gould
Boyd, J., of Applied Phys. V30 #2, Feb. '59, pp. 176-179.
Hillin J., of Crystal Growth, 13/14 5'72, pp. 624-634.
Bowers John L.
Gentile Anthony L.
Stafsudd Oscar M.
Bernstein Hiram
Bethurum William J.
Hughes Aircraft Company
MacAllister William H.
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