Vapor phase soldering apparatus

Details Vapor phase soldering apparatus Vapor phase soldering apparatus

1986-06-05

1987-07-21

Jordan, M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

2281801, 228240, B23K 112

Patent

active

046812490

ABSTRACT:
A vapor phase soldering apparatus for soldering printed circuit boards, including a vessel for containing a heat transfer liquid, partition plates provided within the vessel for dividing the inside space of the vessel into inner and outer chambers which are in fluid communication with each other at upper and lower portions of the partition plates, a heater provided in the inner chamber to heat and to vaporize the heat transfer liquid in the inner chamber, a cooler provided within the outer chamber to cool and to condense vapors of the heat transfer liquid in the outer chamber, and a conveyor for conveying printed circuit boards through the vessel, whereby the printed circuit boards are soldered in the inner chamber by contact with the vapors of said heat transfer liquid, and the vapors escaped from the inner chamber to the outer chamber are condensed in the outer chamber and recycled to the inner chamber.

REFERENCES:
patent: 3866307 (1975-02-01), Pfahl et al.
patent: 4077467 (1978-03-01), Spigarelli
patent: 4090843 (1978-05-01), Chu et al.
patent: 4115601 (1978-09-01), Ammann et al.
patent: 4315042 (1982-02-01), Spigarelli
patent: 4389797 (1983-06-01), Spigarelli et al.

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