Vapor HF etch process mask and method

Details Vapor HF etch process mask and method Vapor HF etch process mask and method

2008-03-04

2008-03-04

Culbert, Roberts (Department: 1763)

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

Mask resist contains organic compound

C216S058000

Reexamination Certificate

active

07338614

ABSTRACT:
A method of processing a semiconductor wafer provides a wafer, and then forms an organic mask on at least a portion of the wafer. The method then applies a vapor etching process to the wafer through holes in the organic mask.

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