Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate
2008-09-09
2008-09-09
Flanigan, Allen J (Department: 3744)
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
C165S104330, C361S700000
Reexamination Certificate
active
11272145
ABSTRACT:
A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.
REFERENCES:
patent: 3952797 (1976-04-01), Voboril et al.
patent: 4118756 (1978-10-01), Nelson et al.
patent: 4170262 (1979-10-01), Marcus et al.
patent: 4351388 (1982-09-01), Calhoun et al.
patent: 4523636 (1985-06-01), Meijer et al.
patent: 5076352 (1991-12-01), Rosenfeld et al.
patent: 5998863 (1999-12-01), Kobayashi et al.
patent: 6056044 (2000-05-01), Benson et al.
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6227287 (2001-05-01), Tanaka et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6302192 (2001-10-01), Dussinger et al.
patent: 6317322 (2001-11-01), Ueki et al.
patent: 6381845 (2002-05-01), Ikeda et al.
patent: 6397935 (2002-06-01), Yamamoto et al.
patent: 6410982 (2002-06-01), Brownell et al.
patent: 6424528 (2002-07-01), Chao
patent: 6460612 (2002-10-01), Sehmbey et al.
patent: 6490160 (2002-12-01), Dibene, II et al.
patent: 6533029 (2003-03-01), Phillips
patent: 6863119 (2005-03-01), Sugito et al.
patent: 2002/0144804 (2002-10-01), Liang et al.
patent: 2003/0056942 (2003-03-01), Ota et al.
patent: 2003/0075306 (2003-04-01), Zuo et al.
patent: 0 251 836 (1988-01-01), None
patent: 0745819 (1996-12-01), None
patent: 0 910 235 (1999-04-01), None
patent: 2000161879 (2000-06-01), None
patent: 2001-24374 (2001-01-01), None
Wei et al., “Fin efficiency enhancement using a gravity-assisted planar heat pipe”, International Journal of Heat and Mass Transfer, vol. 40, No. 5, pp. 1045-1051, 1997.
O'Connell, “Some Don't Like It Hot”, Software Development, pp. 18, Mar. 2003.
Biporous Heat Pipes for High Power Electronic Device Cooling—Abstract of the papers presented at Semi-Therm 2001 (1 page).
M.J. Rightley et al., “Innovative wick design for multi-source, flat plate heat pipes”, Microelectronics Journal 34 (2003) pp. 187-194.
Convergence Technologies (USA), LLC
Edell Shapiro & Finnan LLC
Flanigan Allen J
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