4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With stress relief

Wing Ming Siu

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active

Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Vapor augmented heatsink with multi-wick structure

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate

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Vapor augmented heatsink with multi-wick structure

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2661094

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