Vacuum tip surmo-wick removal system

Details Vacuum tip surmo-wick removal system Vacuum tip surmo-wick removal system

1990-02-26

1992-01-28

Ramsey, Kenneth J.

Metal fusion bonding

Process

With shaping

228 19, 228264, 21912164, B23K 1018

Patent

active

050836986

ABSTRACT:
An effective, convenient, economical and safe system for installing and removing multi-sided gull-wing semiconductor devices from circuit boards without damaging the semiconductor device is provided. The solder removal system is formed by the combination of a surmo-multi-sided wick formed from welded braids and a solder removal gun that has been adapted with a corresponding multi-sided tip face with vacuum capability. An apparatus and process of using such apparatus thereof to produce the multi-sided shape surmo-wick used in the solder removal system are also provided.

REFERENCES:
patent: 3627191 (1971-12-01), Hood, Jr.
patent: 3945553 (1976-03-01), Nicosia
patent: 4066204 (1978-01-01), Wirbser et al.
patent: 4436242 (1984-03-01), Shisler et al.
patent: 4805827 (1989-02-01), Coffman et al.
patent: 4934582 (1990-06-01), Bertram et al.

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