Vacuum processing system

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156345, 118729, 118 501, 414222, 414411, 414416, 414422, 414744R, 414217, H01L 2102

Patent

active

046875425

ABSTRACT:
A system for performing one semiconductor manufacturing operation or sequence of operations with reduced particulate contamination. A vacuum-tight wafer carrier, which contains numerous wafers in vacuum in a sealed box, is placed into a platform inside a vacuum load lock. The platform contains slots and protruding fingers to provide accurate registration of the position of the wafer carrier. After the load lock is pumped down, the door of the wafer carrier is opened, and a transfer arm removes wafers from the wafer carrier, in any desired order, and transfers them one by one through a port into a processing chamber.

REFERENCES:
patent: 4433951 (1984-02-01), Koch et al.
patent: 4501527 (1985-02-01), Jacoby et al.
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4584045 (1986-04-01), Richards
Brown et al, "Cartridge Carrier", IBM-TDB, vol. 21, No. 4, Sep. 1978, p. 1443.
Clark et al, "Wafer Holder", IBM-TDB, vol. 19, No. 10, Mar. 1977, p. 3734.

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