Vacuum processing apparatus having improved throughput

Coating processes – Coating by vapor – gas – or smoke – Base includes an inorganic compound containing silicon or...

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4272557, 4272555, 118719, 118725, 118729, 432 5, 432 18, 432 86, C23C 1600

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active

055123201

ABSTRACT:
A method for depositing sequential thin films on glass substrates by single substrate deposition comprising loading a batch of substrates into a load lock chamber and evacuating the chamber, transferring the substrates to a batch heating chamber for heating the substrates to elevated temperatures; transferring the glass substrates singly to one or more single substrate processing chambers, and sequentially transferring the substrates back to the load lock chamber where they are batch cooled.
A vacuum system for carrying out the method includes a load lock/cooling chamber for evacuating a plurality of glass substrates; a heating chamber for heating a plurality of substrates to elevated temperatures; one or more single substrate processing chambers; and a transfer chamber having access to all of said chambers and having automated means therein for transferring the glass substrates into and out of said chambers in a preselected order.

REFERENCES:
patent: 3945903 (1976-03-01), Svendoir et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4547247 (1985-10-01), Warenback et al.
patent: 4592306 (1986-06-01), Gallego
patent: 4719921 (1987-12-01), Maher et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5259881 (1993-11-01), Edwards
Joint Development Agreement Between Applied Materials, Inc. (Applicant's Assignee) and two unrelated companies (Companies A & B), dated May 29, 1991 (Exhibit A hereto).

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