Vacuum processing apparatus and substrate transfer method

Details Vacuum processing apparatus and substrate transfer method Vacuum processing apparatus and substrate transfer method

2007-04-10

2007-04-10

Vinh, Lan (Department: 1765)

Etching a substrate: processes

Gas phase etching of substrate

C034S405000, C315S111010

Reexamination Certificate

active

11259147

ABSTRACT:
An etching processing apparatus1has a transfer chamber2, a plurality of processing chambers3and4, and a plurality of cassette chambers7and8. Inside the transfer chamber2, a transfer mechanism14is provided. A control device17pauses the operation of the vacuum pump16after closing an opening/closing valve15of a vacuum evacuating mechanism, which vacuum evacuates the transfer chamber2in which the transfer mechanism14is provided, when the operation of the transfer mechanism14is paused for a predetermined time or longer. Accordingly, conservation of energy becomes possible without causing decrease of productivity.

REFERENCES:
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patent: 6473995 (2002-11-01), Miyakawa et al.
patent: 2003/0230322 (2003-12-01), Hillman et al.
patent: 11-204508 (1999-07-01), None
S. Wolf and R.N. Ttauber, Silicon Processing for the VLSI Era, vol. 1—Process Technology, Lattice Press, 1986, pp. 348-353.□□.

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