Vacuum processing apparatus and substrate transfer method

Details Vacuum processing apparatus and substrate transfer method Vacuum processing apparatus and substrate transfer method

2006-01-31

2006-01-31

Lu, Jiping (Department: 3749)

Drying and gas or vapor contact with solids

Apparatus

Vacuum

C034S526000, C034S527000, C034S538000, C034S540000, C034S559000, C034S570000

Reexamination Certificate

active

06990747

ABSTRACT:
An etching processing apparatus1has a transfer chamber2, a plurality of processing chambers3and4, and a plurality of cassette chambers7and8. Inside the transfer chamber2, a transfer mechanism14is provided. A control device17pauses the operation of the vacuum pump16after closing an opening/closing valve15of a vacuum evacuating mechanism, which vacuum evacuates the transfer chamber2in which the transfer mechanism14is provided, when the operation of the transfer mechanism14is paused for a predetermined time or longer. Accordingly, conservation of energy becomes possible without causing decrease of productivity.

REFERENCES:
patent: 6274507 (2001-08-01), Narita et al.
patent: 6473995 (2002-11-01), Miyakawa et al.
patent: 11-204508 (1999-07-01), None

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