Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With etchant gas supply or exhaust structure located outside...
Reexamination Certificate
2005-05-24
2005-05-24
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With etchant gas supply or exhaust structure located outside...
C156S345520, C156S345530, C118S715000, C118S724000, C118S725000, C137S565290
Reexamination Certificate
active
06896764
ABSTRACT:
There is provided a vacuum processing apparatus and an exhausting apparatus of the vacuum processing apparatus according to which the auxiliary vacuum pump can be made smaller or eliminated, and hence energy-saving and space-saving can be achieved, and moreover the floor space occupied by the exhausting apparatus can be reduced, and hence the vacuum processing apparatus as a whole can be made smaller in size. A main vacuum pump has an intake port connected to a processing chamber in which an article to be processed is processed in a vacuum atmosphere, to exhaust the processing chamber to a vacuum state. An auxiliary vacuum pump is connected to a discharge port of the main vacuum pump to exhaust the main vacuum pump to a vacuum state. The main vacuum pump is a high back pressure type pump that exhausts the processing chamber to a vacuum state with a predetermined high back pressure value.
REFERENCES:
patent: 4583301 (1986-04-01), Crowley et al.
patent: 5173041 (1992-12-01), Niimura et al.
patent: 6382041 (2002-05-01), Burgbacher et al.
Hassanzadeh Parviz
Moore Karla
Tokyo Electron Limited
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